I. INTRODUCTION
With the rapid development of wafer processing, Moore's law has started to approach its limit. The demand for high-density, high-power, and super-large packaged devices has increased to meet the rapid growth of the energy required to process electronic devices [1]. Therefore, the heating problem of oversized packaged devices should be urgently solved. As devices work at high temperature for a long time, their reliability is affected because their lifetime may be considerably reduced with increased operating temperature [2].