A preliminary study on the Soft Defects Modeling and Measurement Method using Time-domain Reflectometry

The electro-optic sampling based time domain reflectometry (EOS-TDR) provides a valuable solution for detecting soft defects that may not be easily identified through functional testing. This technique enables individual inspection of each package pin, offering a comprehensive analysis of the structure without requiring specific conditions. In our study, we conducted a preliminary investigation into circuit modeling and high-resolution TDR measurements of soft defects. Both the simulation and measurement results demonstrate the significant potential of EOS-based TDR in effectively detecting soft defects within the package scale under normal circumstances.