Inscription and Characterization of Transversely Written Waveguides in Silicon with Picosecond Laser Pulses

The possibility to permanently modify transparent materials and inscribe waveguiding structures with ultrashort laser pulses is well established for dielectrics such as glasses. Such a technique discloses a versatile set of applications, ranging from telecommunications to photonic quantum circuits. Attempts to transfer this 3D ultrafast inscription technique to the most important material in the microelectronics industry, silicon, failed so far for a transverse inscription strategy.