Research on SiP Assessment Methods for High Reliability Applications

System-in-package (SiP) is an integrated device with low profile, high integration, and diversified functions, suitable for high-reliability application scenarios such as satellites. SiP devices operate in rapid high and low temperature changes, long-term high temperature environment, severe vibration and shock. The reliability of SiP device operating in space is the most important issue. Generally, Sip consists of three-dimensional stacked structure, which includes multiple interfaces such as silicon-silicon and silicon-ceramic. Complex interfaces mean thermal management problems. Electromagnetic coupling effects occur in vertical interconnections and high-density bonding wires. Fine pitch bumps and solder balls face with structural and interface degradation problems caused by electro-thermal coupling stress. This paper analyzes the difficulties of reliability evaluation of SiP for high reliability applications, and proposes a reliability evaluation method based on the process. Simulation and structure analysis are carried out to investigate reliability evaluation technology.