Research on the Dispersion Stability and Polishing Performance of Ceria Slurry

The slurry is based on nano cerium oxide as the abrasive. The effect of adding different organic acids (acetic acid, lactic acid and oxalic acid) during wet milling on the dispersion performance of CeO
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slurry is investigated. It is found that when acetic acid as pH adjuster and it can also as the dispersant. The weight ratio of nano cerium oxide to milling media is 1:4 and the pH is 3.0. After 6 hours of wet milling, the average particle size of CeO
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slurry is 229.1 nm with a Zeta potential of 41 mV. The slurry is formulated with 1 wt% CeO
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at pH 4, the material removal rate of quartz wafer is 413.96 $\displaystyle \mathrm{n}\mathrm{m}/\min.$