Integrating High Frequency Radar Chip Using Laminated Substrate Transitions for System-In-Package Design

This paper presents a novel transition method for interconnecting high-frequency chips within the 90-110 GHz frequency range using planar laminate substrate in advanced packaging. The transitions were designed to connect 50-Ohm grounded coplanar waveguide outputs, and were assembled and characterized using a millimeter-wave chip-scaled package (CSP) and laminated stack-up. Compared to traditional front-end RF pads, the transitions showed minimal performance degradation and energy loss. Each transition was optimized to support an operational bandwidth, with an average insertion loss of 1.5dB and return loss of 15dB. A 3D electromagnetic simulation software was used to optimize the design for the 100 GHz F-band. An air cavity lid could be added for additional protection. The generic and reciprocal transition design could also be used for packaging other electronic or optical components, and coupling electromagnetic waves from the WR to a GCPW.