A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding

We have studied on a novel dielectric polymer adhesive for Cu/polymer-dielectric hybrid bonding process. The adhesive can be temporarily bonded to SiO
2
, SiN, SiCN and itself at room temperature (RT) even after curing and CMP process. Strong permanent bonding strength can be obtained by further annealing. The mechanical processing such as singulation and CMP process are applicable to this polymer adhesive similarly to conventional inorganic materials. In this work, we demonstrated a multi-chip stacking process with Cu-Cu hybrid bonding using this novel polymer adhesive. The results show our adhesive's compatibility with wafer support systems, plasma dicing, and wafer-level cleaning processes using the test wafer/chip.