Modeling temperature distribution using a mathematical method

During reflow soldering of the PCB (Printed Circuit Board), the soldering quality can be improved by knowing the temperature distribution. In practice, it is only possible to measure the temperature in a few places, which limits the setting of the appropriate thermal profile. The article models the temperature distribution using the inverse distance weighting method. The article shows the application of the method through a practical example. It shows a solution for checking the modeled values.