Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV)

With continuous miniaturization of electronic devices, the system complexity and power density increase rapidly, causing localized high heat flux on chips. Hotspot-targeted thermal management has attracted extensive interest due to the concerns about chip performance and reliability. In this work, we proposed a hotspot-targeted hybrid cooling scheme that integrates jet impingement cooling with thermal TSVs. The cooling solution creates a heat transfer route for the hotspot heat flux by combining the high HTC in the stagnation region of jet impingement and superior heat conduction of thermal TSVs. The cooling performance of the scheme is benchmarked by performing CFD simulations. The proposed solution shows a remarkable 54% improvement in temperature uniformity and a significant 20% reduction of temperature rise compared to three other reference cooling solutions, including uniform cooling and stand-alone thermal TSV or impingement jet cooling scheme. In this paper, we investigate the impact of the TSV diameter, shape and TSV density to enhance the cooling performance. Firstly, the TSV dimensions are optimized to reduce occupied routing space. An optimal TSV diameter is obtained, which maintains a low overall thermal resistance and well confines the heat spreading in bulk TSV. Furthermore, we present a design with an exposed TSV array, which could enhance the local HTC in the hotspot region by aligning a protruded TSV array to the impingement jet. The TSV array with an optimal array density is demonstrated to be capable of effectively reducing temperature non-uniformity and peak temperature.