Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics

Optimizing electronic assemblies for more powerful systems includes the usage of temperature-stable substrates with appropriate functionalization by e.g. printing technologies. Ceramic materials like alumina show very good thermal properties and can be printed using Fused Filament Fabrication. Thus, they can be utilized for 2D and 3D substrates in electronic assemblies. In printed electronics, adhesion of inks to substrates is a crucial issue and especially challenging on ceramic substrates. This work achieved a significant increase in adhesion, using a specifically modified silver-based ink with piezojet-printing, while maintaining good electrical resistance after furnace sintering. Adhesion is measured by pull-off testing, based on ISO 4624. By application of the methods described in this paper, ceramics could become a more viable option for use in functional electronic assemblies.