I. Introduction
As ML algorithms got more efficient in recent years, they got involved in failure detection by AOIs [1]. However, electronics manufacturers aim not only to enhance failure detection but also to reduce production errors. Such novel technologies like ML should also support increasing the first pass yield and approaching zero defect manufacturing in the scope of Industry 4.0 [2]. The process for surface mount assembly (SMA) is highly standardized. Possible inspection points for failure detection are clearly defined after stencil printing and component placement since these are the most critical steps in SMA (Fig. 1).
Schematic overview of SMT production line [1]