Electrothermal coupling analysis of microwave windows using finite element method

With the continuous improvement of the performance of microwave electro-vacuum devices, high-power microwave windows are the key component of high-power microwave electro-vacuum devices, which have important influence on the frequency band, power capacity, reliability and service life of the devices. In this paper, a software package called electrothermal coupling simulator (ETCS) is developed for electrothermal coupling analysis of microwave windows by using the finite element method. The influence of temperature-dependent permittivity of ceramics, high-frequency dielectric loss and ambient temperature of heat dissipation on the transmission characteristics is analyzed. Compared with the commercial software ANSYS, the numerical results demonstrate the correctness of ETCS.