Thermal stress reliability comparison of WB and POL-kW structure by Power cycling and simulation

In recent years, the development of wide bandgap (hereinafter referred to as WBG) power semiconductors such as SiC and GaN has been remarkable. Power-Overlay-kiro-Watt (POL-kW) is an innovative packaging technology that can maximize the electrical and thermal performance of power modules using these WBG power devices. In this study, power cycling tests and simulations were performed to confirm the thermal reliability of POL-kW compared to the existing structure. The results showed that the POL-kW passed higher number of cycles in the power cycle test, and the lower stress die connection in the stress simulation compared to the wire bonding structure.