Copper Trace Adhesion Measurement Study for Advanced Substrate Circuitry Patterns

The adhesion of small scale conductive trace patterning is critical to the quality and reliability of advanced electronic packaging. The current study is part of an iNEMI project to define a testing standard for trace features 20μm and below. This paper demonstrates designs and initial application of peel and shear testing on small traces and shows that the strength of fine circuitry patterns does not scale linearly with size. Further analysis on shear test parameters shows how the measurement setup can impact the final results.