The Effects of Process Variations and BTI in Packaged FinFET Devices

A correlation between device reliability and process variations in packaged devices is identified. Weibull distribution statistics are used in a novel method for finding the limit of precision possible for time-to-failure averaging. This study identifies increase of variance due to process variation with size scaling in three generations of technologies. There is a linear decrease in precision threshold which correlates to the size of the device. The results present a concern of BTI in technologies from 16nm and below.