Development and Verification of Effective Layer Function for Simulating Flip-Chip Packages

The design and reliability of semiconductor packages are important for a device to perform its function. In this study, the thermo-mechanical responses of a flip-chip package from its manufacturing loads were analyzed. It is important to accurately predict the deformation and stresses in determining the final design of the package. However, analyzing complicated packages with various parts and materials involved can be computationally expensive; as such a method of simplifying the model through an effective layer function is explored. The goal is to eliminate the complexity of model geometry that significantly affects the solution time without affecting solution accuracy. Statistical measures were taken to determine the accuracy of the analysis system having an effective layer function compared to the previously validated model with actual package configuration.