Modelling Creep Behaviour in Sintered Silver using User-Programmable Features in ANSYS

New reliability and lifetime requirements for power modules employing wide-bandgap semiconductors in automotive application demand a better understanding and precise modeling of the material behavior of the involved materials. A widely used die attach technology is the usage of sintered silver which can withstand the induced fatigue. However, the understanding and modeling of its deformation mechanisms is not yet complete. In this study, a first purposeful creep model for sintered silver including primary and secondary creep will be presented and implemented in finite element simulation by means of a user-programmable feature. Additionally, a detection algorithm for load path changes is developed.