Accurate Resistance Modeling of Cu-CNT ULSI Interconnects

This paper presents an accurate resistance model of hybrid copper-carbon nanotube (Cu-CNT) ultra-large-scale integration (ULSI) interconnects. The proposed resistance model is validated with the experimental data for Cu-CNT lines for practical applications. The proposed model for CuCNT ULSI interconnects analyzes a range of test cases for various filling ratios (0-1) at different cross-sectional areas (0.005-0.080$\mu \mathrm{m}^{2}$). It is observed that Cu-CNT interconnects exhibit more than 80% and 16 % line resistance improvement compared to CNT and Cu interconnects, respectively.