A SISL Coupler using Two Layers of Coupled Line Structure with Dense Interconnecting Vias

In this paper, A substrate integrated suspended Line(SISL) coupler using two layers of coupled line structure with dense interconnecting vias has been proposed. SISL technology can realize low loss, light weight, and self-packaging. Two layers of coupled line structure with dense interconnecting vias can achieve coupling enhancement for the coupler. This coupler has been designed, fabricated, and measured at 3.05GHz.