Advanced Ti+Cu Seed Sputter Technologies for Glass Substrates with Through Glass Via and Through Cavities Glass as well as Low-K Polymer Laminated Glass Substrates

With increased bandwidth requirements for commercial, high performance computing and artificial intelligence applications, there is a need to increase the IO density of fine line features, small microvias and low-K dielectrics in future IC-Substrates and interposers. While BEOL processing has enabled achieving very high-density interconnects in Silicon-based integration systems on wafer level - like Intel's EMIB technology with BEOL techniques has accomplished 225 IOs/mm/layer with < 2 m L/S., panel scale packaging using m-SAP and SAP RDL, could only accommodate <50 IOs/mm/layer. The near-future needs of the advanced technologies should be able to overcome the shortcomings of the current interposer technologies that include: 1) low-K materials with dielectric constants much lower than that of SiO2, 2) ability to support data rates greater than 10 Gbps with low resistance and capacitance, 3) low cost panel scale processes with potential to increase fine line features and scale up substrates sizes. Evatec has carried out extensive research together with Institutes and Cooperation partner on new materials and process developments along with their optimization on glass substrates as a viable low cost technology for next generation IC-Substrates and large interposers. This work presents a review of the current Ti+Cu Seed Sputter technologies with their capabilities and limits. As well as strategies that have the potential to enable future design rules and ideas. Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offers a pathway moving forward to support industry roadmaps. Processing substrates with high organic load and ambitious topographies requires distinct process capabilities and well aligned process steps. This paper explains the most important do's and don'ts for vacuum processing of organic substrates and its impact on the final devices.