I. Introduction
With the rapid development of high-power devices, the thermal management issue becoming has become one of the most critical issues of the package. The huge heat generation will bring a higher junction temperature, causing many reliability problems such as performance degradation, material aging, and short lifetime [1]–[3]. According to previous studies, high temperature is one of the major reasons of device failures [4]. The failure rate of power devices grows exponentially with the junction temperature. Therefore, reliability of power components is sensitive to the junction temperature. Thermal management has become one of the major issues in development of power packages. The thermal performance of mainstream packages is no longer meet the needs of advanced high-power devices Therefore, it is necessary to develop a package structure with stronger heat dissipation capability.