Thermal Stability Characterization of High-Temperature Solders in Power Surface Mount Devices

High-temperature solders are used as attaching materials in some power surface mount devices such as power diodes, MOSFETs, and IGBTs. Power surface mount devices are bill of materials for the downstream board-level assembly, and they will be surface mounted on printed circuit boards and flexible printed circuits typically with a reflow soldering process. The high-temperature solders in power surface mount devices should not re-melt and maintain their thermal stability in the downstream board-level assembly. Differential scanning calorimetry analysis, visual inspection via a reflow simulator, and tensile testing are considered to characterize the thermal stability of multiple-type high-temperature solders.