Abstract:
The increasing demands for computation power in cloud computing have driven the need for complex larger data centers and super computers where many-core processors chips ...Show MoreMetadata
Abstract:
The increasing demands for computation power in cloud computing have driven the need for complex larger data centers and super computers where many-core processors chips are connected through multiple printed boards. This requirement has dramatically increased the complexity and the cost of inter/intra-chip communication between cores in different chips that are running the same applications. In this paper, a seamless hybrid interconnect architecture is proposed that utilizes the power and performance efficient Surface-wave interconnects (SWIs). Consequently, the system level evaluation demonstrates the significant improvements in terms of performance (up to 67%) and power consumption (up to ~1.3 X). Therefore, this proposed on-chip/off-chip hybrid interconnect architecture has created potential for future communication centric cutting edge data centers and/or super-computers.
Published in: 2022 Iraqi International Conference on Communication and Information Technologies (IICCIT)
Date of Conference: 07-08 September 2022
Date Added to IEEE Xplore: 13 January 2023
ISBN Information: