I. Introduction
The insulation strength of discharge gaps is one of the main factors determining the reliability of HV devices. The electrical breakdown is induced either by microscopic projection on electrode surface or by free conducting particles and occurs as a result of self-sustaining avalanche process of ionization of gas molecules by free electrons. In this paper our attention is focused on the electrical breakdown induced by microscopic projection on the electrode surface. Conditions at which the breakdown of a discharge gap takes place are determined by rates of gas ionization and electron emission at the cathode [1], [2]. The rates of these processes rise sharply with increase in electric field strength. Therefore breakdown occurs at the place of local amplification of electric field caused by sharp microscopic projections on the electrode surface arising on the surface due to random factors such as machining of a surface, erosion under the action of environment or electrical discharge, etc. Existence of inevitable microscopic pollutions on the surface, oil films, and absorption of gas molecules may also effect the dielectric strength. Emission surface properties and electric field at electrodes are random variables which can differ in various sites of the surface and change accidentally. The breakdown voltage level of a high voltage device can therefore be predicted in a statistical sense [3]. Also it is necessary to note, that the surface of electrodes can be significantly changed as a result of tests. In high power switching devices erosion of the electrodes, caused by arcing, substantially changes the electrode surface state.