I. Introduction
Leakage current, nowadays, is the dominant power dissipation source in the large SRAM cell array. Driven by the intensive low power application demand, how to suppress the leakage current has been a critical topic for the memory designers during the past decade. One of the most effective ways for leakage current suppression in the SRAM cell array is to reduce the supply voltage (Vdd) [3]. This method, however, sacrifices the robustness of the SRAM cell since the data stored at the internal node will degrade as the supply voltage decreases. On the other hand, the variations of process or device parameters put a further challenge to the reliability of SRAM cell design [2]. One of the known variation sources in the SRAM cell is the threshold voltage mismatch due to the random fluctuation of the dopant atoms in the device channel [1] which is called Random Dopant Fluctuation (RDF). Since this random variation is inversely proportional to the device area, it manifests itself significantly in the large SRAM cell array where minimum geometry size is usually adopted in order to achieve a high density occupation. in addition, some other sources such as the geometry variations in transistor width and channel length introduced from the manufacture process and the fluctuation of temperature cannot be ignored. These unpredictable parameter variations will break the internal balance of SRAM cells and deteriorate the stored data. The minimum supply voltage to keep a correct data stored in the SRAM cell at the presence of variations is called Data Retention Voltage (DRV) [3]. Accurate estimation of the DRV is a critical demand for both robust and low power design.