1 Introduction
Modern deep sub-micron silicon technologies have given a real boost to system-on-a-chip (SOC) design research and development. The growing diversity of devices brings up an immense number of possible interfaces. In many situations, both the system design and performance are limited by the complexity of the interconnection between the different modules and blocks that are integrated into those chips. Furthermore, different data transfer speeds are required as well as parallel transmission. A simple bus is one such structure that may not be suitable for such a design. This is because only one module can transmit at a time and the bus is slow due to large capacitive load [6] caused by the interfaces of the modules that are attached to it and the long physical length.