Progress on developing electronic packaging educational modules

This paper describes progress on developing a new course on electronics packaging at Arizona State University. The course is designed to cover multi-disciplinary subjects in electronics packaging. During the course development, some multimedia modules were developed using Sync-O-Matic software tool. The packaging lecture modules can be downloaded from the website for individual learning and review. We have received some start-up funding from the IEEE CPMT Society and the National Science Foundation to develop more modules that are critical in electronics packaging education. We are planning to develop modules in modeling and simulation of electronic packaging. To date, we have developed modules in interconnect modeling, embedded passives, simultaneous switching noise and package electrical testing. We have worked on more efficient software tools for making the multimedia modules (i.e., next generation Sync-O-Matic).