Technical review on thermal conductivity measurement techniques for thin thermal interfaces

Principles and techniques of three ASTM test methods of measuring thermal conductivity and thermal impedance of thin thermal interfaces are discussed. Although some measurement limitations exist in these ASTM methods, they provide an excellent starting point for the development of thermal property test protocols. The key issue is to minimize the error associated with the assumptions related to the thermal contact resistance. This paper presents a fundamental and philosophical view of an ideal thermal conductivity measurement system. A measurement device and technique were developed that incorporates these ideals by modifying existing ASTM test methods. The developed technique provides a systematic means of minimizing measurement errors and increasing measurement sensitivity.