Microrelay packaging technology using flip-chip assembly

Using flip-chip assembly, micromachined connectors can be used to create a high density, actuatable electronics packaging technology. Internal residual stress is used to press bimorph beam connectors upwards against a device chip. Deformation can be increased by introducing stress through a heat treating process. The effects of heat treatment are more prominent on larger devices and are long lasting in nature. The connectors' actuation behavior is described, including appropriate mathematical models. The electrostatically actuated beams will disconnect when driven by a 53 volt signal and will reconnect when voltage falls below 43 volts. When switching signals, reconnection occurs in as little as 5.8 /spl mu/s, disconnection occurs in as little as 4.0 /spl mu/s. A microconnector's current carrying capability can be as high as 285.3 mA and its maximum power dissipation as high as 1.47 W.