Plasma etching of ALX 2010 polymer for WLP applications

Polymers are used for packaging, passive device fabrication or generally as buffer layer. Now a new polymer, the ALX is available. In this study the development of a plasma etching process of ALX 2010 is described. Compared to the lithographic feature definition, critical dimensions (CD) below ALX resolution and controlling the profile of the etched ALX is possible. The application of the RIE process on first WLP structures is shown.