Antenna on a thick resin layer of a silicon chip and a slab antenna fed by post-wall waveguide

This paper presents two topics on antennas in packaging for millimeter-wave applications. One is on a patch antenna on a thick resin layer of a silicon chip to achieve high radiation efficiency and to try to connect a RF circuit on the opposite side of the chip through a coax-line structure. The other is a dielectric-slab antenna fed by post-wall waveguide to have about 45-degree beam-width in both the E and H planes and to achieve 46dB isolation by arraying the two antennas in the H-plane.