I. Introduction
Advanced applications in consumer electronics (printers, scanners, etc.) and in automotive [1] are dedicated to monitoring external elements; integrating low- and high-voltage (HV) electronics functions on the same application-specified integrated circuit (ASIC), called Smart Power IC is then required. These technologies are integrated on standard low-voltage CMOS technologies with some additional steps to implement HV transistors. Smart Power ICs can sustain dozens of volts and drive currents of several amperes. However, such “hybrid” integration is also responsible for deleterious parasitic substrate currents that propagate from HV devices to sensitive low-voltage circuits, therefore, degrading the overall circuit performance.