A shielded microstrip-to-stripline vertical transition for multilayer printed circuit board

This paper reports on a shielded vertical transition in multilayer PCBs. The design and analysis of microstrip-tostripline transition are presented, and back-to-back arrangements are considered. These interconnections are simulated and optimized by three-dimensional electromagnetic simulations, presents great performances from dc up to 40 GHz. A prototype is manufactured on RO4003c. Two band-pass filters in stripline technique are presented as the examples of application.