BGA MPI socket analysis and validation

The design of a ball grid array metalized particle interconnect (BGA MPI) socket is presented. A novel design using static force system using less force and components instead of a dynamic one is shown. The performance of MPI socket has been characterized mechanically as deformation value and electrically as S parameters for different compression force. The MPI has been validated at laboratory using continuity, resistance and validation test. All of tests successfully passed which probed the socket design.