I. Introduction
As microelectronics technology continues to progress, there is a continuous focus on higher levels of system integration and miniaturization. For example, in many applications, it is desirable to package several integrated circuits (ICs) together in multichip modules (MCMs) to achieve further compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are an essential requirement for many MCM applications [1]. A significant advantage of MCM technology is the ability to embed large number of these passive components directly into the substrate at low cost. Such an arrangement provides further advantages in component miniaturization, power consumption, reliability, and performance.