Effects of annealing on microstructure of osmium-ruthenium thin films

Osmium-ruthenium (OsRu) thin films of different thickness were deposited on porous tungsten (W) pellets in a configuration similar to dispenser cathodes, using two separate sputtering systems. In order to assess which films may best inhibit interdiffusion between the OsRu film and the W substrate during annealing, the grain structure and texture of OsRu films were characterized by x-ray diffraction and scanning electron microscopy.