1. Introduction
A large electronic packaging signal interconnect system contains hundreds even thousands signal channels. Each channel links a driver output to a receiver input (Figure 1). Each channel may contain multiple packaging levels including ceramic or organic module via and wire, module-to-card connector, card via and wire, cable, cable-to-card connector, and card-to-card connector. There is crosstalk between adjacent channels which affect the system signal integrity (SI) performance depending on the real coupling situation. It should be mentioned that Figure 1 is a plane graph for a brief topology illustration only. It does not show the real distance between two channels. For example, some part of Channel 1 may be very close to some part of Channel Nc.