I. Introduction
Reliability screening of integrated circuits (ICs) is an important step in semiconductor manufacturing. Burn-in is a widely used reliability screening technique that identifies latent defects in ICs before they are shipped to customers [1]. Wafer-level burn-in (WLBI) has recently emerged as an enabling technology to lower the cost of burn-in [2]. In this approach, devices are subjected to burn-in and electrical testing while in the bare wafer form. By moving the burn-in process to the wafer-level, significant cost savings can be achieved in the form of lower packaging costs, as well as reduced burn-in and test time.