I. Introduction
THE increasing sophistication of products induces changes both in manufacturing processes and in the quality of materials used. There is a general trend towards lower tolerances for both physical and chemical properties in materials and parts. Semiconductor manufacturing is the most extreme representative of this trend, which requires raw materials with impurity levels in the parts per billion and cleanroom processing environments with less than 10 particles greater than 0.1µm in size per cubic meter. Purifying water and nitrogen accounts for 5% and 7% of fabrication facility electricity use respectively [1]. Production of silicon wafers is some 160 times more energy intensive per kilogram than the usual industrial grade [2]. The operation of cleanrooms (ventilation, heating, cooling) accounts for 30–46% of electricity consumption in fabrication facilities [1]. This suggests that in addition to purification of input materials, the need to create low-entropy environments when combining materials is also important in understanding energy consumption.