Multichip self-assembly technique on flexible polymeric substrate

We newly introduce a batch assembly technique of a number of LSI and MEMS chips onto Si or flexible polymeric substrates using self-assembly driven by surface tension of a small volume of liquid. Self-assembly can provide batch processes including high-precision chip alignment within 0.1 sec and bonding with high adhesion strength more than 5 MPa at room temperature without applying pressure on the chips. The alignment accuracy was found to be approximately 300 nm under optimized conditions when Si wafers were employed as substrates. We also demonstrated multichip self- assembly with a droplet of aqueous or resin solutions onto polymeric substrates with an alignment accuracy of several microns.