Novel approach for a non-etching adhesion promoter for the next generation of IC substrates

Targeted for meeting the requirements of advanced IC manufactures for a Non- Etching Adhesion Promoter (NEAP) in the manufacture of sub 10/10μm line and space, the Secure™ HFz process represents an innovative approach to enhancing the bonding of Ajinomoto Build-up Film (ABF) materials and comparable films as well as solder masks while not significantly etching the copper conductor to promote adhesion but rather using Silane based chemical adhesion promoters. A complete description of the process and its operating parameters will be presented. As this technical paper will demonstrate, this process achieves superior bonding strength and thermal reliability for not only ABF materials but also high-performance substrates and prepregs in comparison to more traditional copper roughening treatment methods. A complete process characterization has been done to illustrate the merits of Secure™ HFz. The surface was characterized using Scanning Electron Microscopy (SEM), Laser Interference Microscopy (LIM), and Atomic Force Microscopy (AFM) techniques. While the adhesion and thermal performance was done using standard industrial methods such as peel strength.