Deformable Silicon Electronics Using Segmentation and Flexible Interconnect

In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology [1] is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness (silicon/SiO
₂
) of ~1 μm, segment size between 150 and 450 μm, spacing of 20-200 mum and serpentine-shaped aluminum interconnect transferred onto 8-10 μm thick polyimide film are characterized by bending and tensile stretching to find out the reliability limits. Compared to our previous reports [2,3], next to the processing issues also new electrical integrity results obtained from passive electrical test structures implemented on fully segmented polymer-embedded silicon islands are presented.