Multi-Layered Substrates for Wireless Communication Modules at 60GHz

A low-cost module structure for millimeterwave wireless communication is proposed. Hermetically sealed circuits and printed antennas are built on the opposite sides of a multi-layered substrate. Slot-coupled electromagnetic interconnects in multi-layered substrates with more than three layers were investigated experimentally. Broad band 50Ο matching and about 4.6dBi gain were achieved by a single patch antenna directly printed on the ceramic multilayered substrate with high εr = 8.9. Suitability of the proposed structure for array antenna design is discussed.