In-Situ, Real-Time Detector for Faults in Solder Joint Networks Belonging to Operational, Fully Programmed Field Programmabmle Gate Arrays (FPGAS)

In this paper we introduce an in-situ solder-joint built-in self-test (SJ BIST) for detecting high-resistance faults in operational, fully-programmed field programmable gate arrays (FPGAs). The approach is simple to implement, offers a method to detect high- resistance faults that result from damaged solder-joints, and uses a maximum of one small capacitor externally-connected to each selected test pin or each group of two test pins.

Introduction

This paper introduces an innovative, in-situ solder-joint built-in self-test (SJ BIST) to detect high-resistance damage to solder-joint networks of fully operational Field Programmable Gate Arrays (FPGAs) in ball-grid array (BGA) packages such as a XILINX® FG1152/FG1156. FPGAs are used in all manner and kinds of control systems in both defense and commercial applications.