Increasing the resistivity of electrodeposited high B/sub S/ CoNiFe thin film

In order to increase the resistivity of electrodeposited high B/sub S/ CoNiFe thin film, the effect of an organic additive such as diethylenetriamine (DET) added to the plating bath was investigated. The values of /spl rho/ and H/sub C/ were gradually increased as a function of DET concentration. The desirable soft magnetic CoNiFe thin film with /spl rho/=25-90 /spl mu//spl Omega/-cm under the conditions of B/sub S/>1.9 T and H/sub C/<2.5 Oe was developed as function of carbon in the deposited films. Additionally, the high resistivity CoNiFe thin film with /spl rho/=130 /spl mu//spl Omega/-cm was established under the conditions of B/sub S/=1.7 T and H/sub C/<6 0e.