Improvement of Poly-Pimple-Induced Device Mismatch on 6T-SRAM at 65-nm CMOS Technology

An incremental poly etching method can improve the poly pimple defect-induced device mismatch on the static noise margin (SNM) of 65-nm-node low-power 6T-SRAM. The improvement on circuit level is examined by the yield of scan chain and memory built-in self-test (MBIST), which is known to correlate well to process-induced defects.