Linewidth control in projection lithography using a multilayer resist process

Linewidth control using a tri-layer resist system on wafers with topography is investigated. An absorbing dye is incorporated in the bottom layer to improve the usable resolution. Resist patterns of 1-µm lines and spaces over aluminized topography are demonstrated using a projection aligner. The advantages of a multilayer system are investigated using an exposure and development simulation program for optical lithography. The relative contributions of planarization and reflection suppression are discussed.