A novel concept for MM-wave MMIC interconnects and packaging

Standard interconnect and packaging techniques for MMICs tend to get more and more difficult at MM-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling for interconnects and package feed-through elements. First theoretical and (scaled) experimental results are presented.<
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