Generic packaging technologies for T/R-modules

This paper presents some recent evaluations of packaging technologies for T/R modules over a broad frequency range. The report also presents some examples of hardware demonstrators using the described technologies. The used methodologies are sub-divided into carrier substrates, component interconnection and packaging, heat transfer methods, mechanical architecture and internal and external module interconnections. Accelerated test methods for vibration, temperature cycling, contamination and migration have been developed. The environmental evaluation has focused on finding disruptive failure mechanisms to point out possible weaknesses in each different technology for the used method. By dividing the applicable building techniques into subgroups and evaluate each group individually, we have achieved a mixed hors d'oeuvre of evaluated and verified building elements as a foundation for future cost efficient development of T/R-modules.