A novel microstrip-compatible technique for depositing YBa/sub 2/Cu/sub 3/O/sub 7- delta / on both surfaces of a substrate

A technique for the deposition of YBa/sub 2/Cu/sub 3/O/sub 7- delta / on both the top and bottom surfaces of a substrate by pulsed laser deposition is reported. This approach employs a metallic buffer layer to protect the first YBa/sub 2/Cu/sub 3/O/sub 7- delta / film while the second film is deposited. It is particularly applicable to microstrip-based circuit topologies where the ground plane conductor requires minimal patterning. The performance of microstrip ring resonators, fabricated by this technique, is substantially better than can be achieved with microstrip ring resonators which consist of a superconducting ring and a normal-conductor ground plane. This approach allows the deposition of YBa/sub 2/Cu/sub 3/O/sub 7- delta / on both sides of the substrate without the need for radiative heating schemes and can accommodate any size and shape of substrate.<
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